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Huawei H13-231 中文 Exam Syllabus Topics:
| Section | Weight | Objectives |
|---|---|---|
| Topic 1: Intelligent Computing Solution Design | 25% | - High availability and reliability design - Requirements analysis and architecture design - Server and hardware configuration - Software stack selection and deployment |
| Topic 2: Key Technologies and Applications | 35% | - Kunpeng architecture and processor technology - Storage and network integration - Virtualization and container technology - Compiler and optimization tools - Ascend AI processor and computing framework |
| Topic 3: System Deployment, Tuning and Maintenance | 20% | - Installation and deployment procedures - Monitoring, O&M and fault handling - Security and compliance management - Performance tuning methodology |
| Topic 4: Computing Ecosystem Business Insights | 20% | - Industry trends and development status - Kunpeng and Ascend ecosystem overview - Typical application scenarios and value analysis |
Huawei HCIE-Intelligent Computing V1.0 (H13-231中文版) Sample Questions:
1. 某公司想要將原來X86平台Linux下的一個java程式遷移到鯕鵬平台。TaiShan伺服器上已安裝EulerOS。可以執行下列哪些命令?
A) yum 安裝 java-1.8.0-openjdk。
B) yum 更新 java-1.8.0-openjdk。
C) apt-get 更新 java-1.8.0-openjdk。
D) apt-get 安裝 java-1.8.0-openjdk。
2. 以下關於 CISC 和 RISC 比較的敘述哪一項是正確的?(多項選擇)
A) CISC程式需要較大的記憶體空間,不易設計
B) CISC對記憶體有更多的控制指令
C) CISC的指令系統比RISC的指令系統複雜
D) CISC晶片設計週期短
3. 總線技術的發展,PC/XT -> ISA匯流排 -> 擴展ISA匯流排 -> AGP匯流排 -> PCI匯流排 -> PCI-Express匯流排。
A) 正確
B) 錯誤
4. 以下關於 UDIMM、RDIMM 和 LRDIMM 比較的哪些敘述是正確的?(多項選擇)
A) UDIMM需要確保CPU與每個記憶體顆粒之間的傳輸距離相等,這樣並行傳輸才有效,而這需要較高的製造工藝,因此UDIMM的容量和頻率很低。
B) 與RDIMM、LRDIMM相比,降低了記憶體匯流排的負載和功耗,並提供了記憶體的最大支援容量。
C) RDIMM支援Bufferered模式和高效能Registered模式,比UDIMM更穩定,支援最高容量的伺服器記憶體。
D) UDIMM無緩衝雙列直插記憶體模組位址和控制訊號直接到達DIMM上的DRAM晶片,無需緩衝,因此價格便宜。
5. 摩爾定律的意思是:當價格不變時,容納積體電路的元件類別數量,大約每18-24個月就會增加一倍,效能也會增加一倍,換句話說,每18-24個月可以買到的電腦效能就增加一倍。美元每 18-24 個月就會增加一倍以上。
A) 正確
B) 錯誤
Solutions:
| Question # 1 Answer: A | Question # 2 Answer: B,C,D | Question # 3 Answer: B | Question # 4 Answer: A,D | Question # 5 Answer: A |







